Technical Specs
| Item | Standard Specifications | Advanced Specifications |
|---|---|---|
| Number of Layers | 1-8 Layers | 10-20 Layers |
| Base Material | FR4, Aluminum Based | ShengyiTG170, IT180, Teflon, Rogers, FPC |
| Finish Board Thickness | 12 mil – 200 mil | 8 mil – 240 mil |
| Minimum Core Thickness | 6 mil | 4 mil |
| Copper Thickness | Min. 1/2 OZ – Max. 4 OZ | Min. 1/4 OZ – Max. 15 OZ |
| Hole Copper Thickness | Min. 0.8 mil | Min. 1 mil |
| Panel Size | 27.559055 in. x 19.685039 in. (Max) | 23.6220424 in. x 39.3700787 in. (Max) |
| Min. Trace Wide & Line Space | 5 mil | 4 mil |
| Min. Hole Diameter (Drilling/PTH) | 12 mil | 8 mil |
| Min. Hole Diameter (Blind Hole) | 4 – 6 mil | |
| Aspect Ratio | 6:01 | 12:01 |
| Solder Mask Color | Green, Black, White, Yellow, Blue, Red, Matte Green, Matte Black, Clear | Green, Black, White, Yellow, Blue, Red, Matte Green, Matte Black, Clear |
| Solder Mask Bridge | Min. 5 mil | Min. 4 mil |
| Dimension – Hole Position | 3 mil | 2 mil |
| Tolerance – Condutor Width | 20% Deviation of Master A/W | 1 mil Deviation of Master A/W |
| Hole Diameter (H) | NPTH +/- 2 mil | NPTH +/- 2 mil |
| Hole Diameter (H) | PTH +/- 3 mil | PTH +/- 2 mil |
| Outline Dimensions | 6 mil | 4 mil |
| Conduotors & Outline | 6 mil | 5 mil |
| Warp & Twist | .75% | .50% |
Capability Sheets
| Surface Treatment | Standard Specifications | Advanced Specifications |
|---|---|---|
| Lead Free HASL | 3 um (min) | 3 um (min) |
| OSP | 0.2 – 0.5 um | 0.2 – 0.5 um |
| Immersion Silver | 0.15 – 0.5 um | 0.15 – 0.5 um |
| Immersion Tin | 0.8 – 1.2 um | 0.8 – 1.2 um |
| Immersion Gold | Au 1-3u” | Au 1-10u” |
| Hard Gold | Au 5-50u” | |
| Selective Gold | Au 3-150u” | |
| Ni/Pd/Au | Pd 4u” Au 4u” |
| Item | Description | Standard Specifications | Advanced Specifications |
|---|---|---|---|
| V-Cut | Board Thickness | Min. 20 mil | Min. 12 mil |
| V-Cut | Remain Thickness | 1/3 Board Thickness | |
| V-Cut | Tolerance | +/- 5 mil | +/- 4 mil |
| V-Cut | Groove Width | 20 mil Max | 15 mil Max |
| V-Cut | Groove to Groove | 787 mil Min. | 394 mil Min. |
| V-Cut | Groove to Trace | 18 mil Min. | 15 mil Min. |
| Slot | Slot Size Tol L>/=2W | PTH Slot: Length +/- 5 mil ; Width +/- 3 mil | PTH Slot: Length +/- 4 mil ; Width +/- 2 mil |
| Slot | Slot Size Tol L>/=2W | NPTH Slot: Length +/- 4 mil | NPTH Slot: Length +/- 3 mil ; Width +/- 2 mil |
| Hole Edge to Edge | 0.30 – 1.60 Hole Diameter | 6 mil | 4 mil |
| Hole Edge to Edge | 1.61 – 6.5 Hole Diameter | 6 mil | 5 mil |
| Min. Spacing between Hole Edge and Circuit Pattern | PTH Hole 8 mil | PTH Hole 5 mil | PTH Hole 5 mil |
| Min. Spacing between Hole Edge and Circuit Pattern | PTH Hole 8 mil | NPTH Hole 4 mil | NPTH Hole 4 mil |
More of Our Capabilities
| Item | Standard Specifications | Advanced Specifications |
|---|---|---|
| Layer-Layer Misregistration: 4 Layers | 6 mil Max. | 4 mil Max. |
| Layer-Layer Misregistration: 6 Layers | 8 mil Max. | 5 mil Max. |
| Layer-Layer Misregistration: 8 Layers | 9 mil Max. | 6 mil Max. |
| Min. Spacing between Hole Edge and Innerlay Pattern | 9 mil | 6 mil |
| Min. Spacing between Outline and Innerlay Pattern | 15 mil | 9 mil |
| Min. Board Thickness: 4 Layers | 16 mil | 112 mil |
| Min. Board Thickness: 6 Layers | 24 mil | 200 mil |
| Min. Board Thickness: 8 Layers | 40 mil | 300 mil |
| 4 Layer Board Thickness Tolerance | 5 mil | 4 mil |
| 6 Layer Board Thickness Tolerance | 6 mil | 5 mil |
| 8-12 Layer Board Thickness Tolerance | 8 mil | 6 mil |
| Insulation Resistance | 10K~20M (Typical 5M) | |
| Conductivity | <50 (Typical 25) | |
| Test Voltage | 250V | |
| Impedance Control | Typical 50 +/-10% |
